2eeb3dbc5b
* Move chip metadata into TOML files and update build script to consume them * Make necessary changes to get all examples building again
55 lines
763 B
TOML
55 lines
763 B
TOML
[device]
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arch = "xtensa"
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cores = "single_core"
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peripherals = [
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# Peripherals available in the PAC:
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"aes",
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"apb_saradc",
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"dedicated_gpio",
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"ds",
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"efuse",
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"extmem",
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"gpio",
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"gpio_sd",
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"hmac",
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"i2c0",
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"i2c1",
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"i2s0",
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"interrupt_core0",
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"io_mux",
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"ledc",
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"pcnt",
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"pms",
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"rmt",
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"rng",
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"rsa",
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"rtc_cntl",
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"rtc_i2c",
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"rtc_io",
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"sens",
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"sha",
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"spi0",
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"spi1",
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"spi2",
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"spi3",
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"spi4",
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"system",
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"systimer",
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"timg0",
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"timg1",
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"twai0",
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"uart0",
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"uart1",
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"uhci0",
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"usb0",
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"usb_wrap",
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"xts_aes",
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# Additional peripherals defined by us (the developers):
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"adc",
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"dac",
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"pdma",
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"radio",
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]
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