2eeb3dbc5b
* Move chip metadata into TOML files and update build script to consume them * Make necessary changes to get all examples building again
57 lines
775 B
TOML
57 lines
775 B
TOML
[device]
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arch = "xtensa"
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cores = "multi_core"
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peripherals = [
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# Peripherals available in the PAC:
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"aes",
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"apb_ctrl",
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"bb",
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"dport",
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"efuse",
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"flash_encryption",
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"frc_timer",
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"gpio",
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"gpio_sd",
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"hinf",
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"i2c0",
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"i2c1",
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"i2s0",
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"i2s1",
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"io_mux",
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"ledc",
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"mcpwm0",
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"mcpwm1",
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"nrx",
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"pcnt",
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"rmt",
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"rng",
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"rsa",
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"rtc_cntl",
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"rtc_i2c",
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"rtc_io",
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"sdmmc",
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"sens",
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"sha",
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"slc",
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"slchost",
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"spi0",
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"spi1",
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"spi2",
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"spi3",
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"timg0",
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"timg1",
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"twai0",
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"uart0",
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"uart1",
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"uart2",
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"uhci0",
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"uhci1",
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# Additional peripherals defined by us (the developers):
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"adc",
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"dac",
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"pdma",
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"radio",
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]
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